JPS63157976U - - Google Patents
Info
- Publication number
- JPS63157976U JPS63157976U JP5006487U JP5006487U JPS63157976U JP S63157976 U JPS63157976 U JP S63157976U JP 5006487 U JP5006487 U JP 5006487U JP 5006487 U JP5006487 U JP 5006487U JP S63157976 U JPS63157976 U JP S63157976U
- Authority
- JP
- Japan
- Prior art keywords
- leadless chip
- chip component
- pad
- solder
- solder fillet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5006487U JPS63157976U (en]) | 1987-04-02 | 1987-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5006487U JPS63157976U (en]) | 1987-04-02 | 1987-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157976U true JPS63157976U (en]) | 1988-10-17 |
Family
ID=30873076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5006487U Pending JPS63157976U (en]) | 1987-04-02 | 1987-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157976U (en]) |
-
1987
- 1987-04-02 JP JP5006487U patent/JPS63157976U/ja active Pending